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ISOBOND SR 740 – SD 746 , 400g, system is a new generation epoxy adhesive system specially formulated for adhesive seals up to 25 mm thick.
Its high tenacity and very good fatigue resistance make it a first choice adhesive for high-performance structural bonding subjected to significant dynamic stresses.
Mixing ratio By volume 100 / 50
Gel Time (1 mm) 30 °C 02 h 15
Waiting time before clamping 30 °C 1 min
· High glass transition temperature
· Multi-material mixed glue
· Low toxicity
· In the process of DNV certification
Post-curing
The thermomechanical values of an epoxy system can be optimized by implementing a post-curing cycle. The Sicomin laboratory provides several predefined post cure cycles on its data sheets allowing users to compare systems. These experimental cycles are adaptable to your specific applications, taking the following parameters into account:
Many systems can provide good mechanical properties after curing at room temperature and from 18°C for 24 to 48 hours before demolding.
The mechanical properties progress very quickly with a slightly higher temperature of around 40°C for several hours. Epoxy systems with high Tg and slow and extra-slow hardeners imperatively require post-curing at a higher temperature. It is possible to start the cycle as soon as the exothermic peak passes, but also to start post-curing later after assembly of the various components and before the finishing operations. If the nature of the models and tools is not suitable for high temperatures, we recommend carrying out the first stages up to the maximum admissible temperature then, after cooling and demoulding, continuing the cycle on a suitable former.
For a conventional epoxy system, we recommend carrying out a cycle in steps of 20°C for 4 hours.
Example for an epoxy system Tg max 100°C:
4 hrs at 40°C + 4 hrs at 60°C + 4 hrs at 80°C + cooling to room temperature before unmoulding.
